Dr. Robert Evans
Electrical and Computer Engineering
ECE 544 Design of Electronic Packaging and Interconnects
3 Credit Hours
A study of the design of digital and mixed signal interconnect and packaging. Topics covered include: single chip (surface mount and through-hole) and multichip module packaging technology, packaging technology selection, electrical performance of packaging, thermal design, electrical design of printed circuit boards, backplane and multichip module interconnect, receiver and driver selection, EMI control, CAD tools, and measurement issues.