ECE 544 Design of Electronic Packaging and Interconnects

3 Credit Hours

A study of the design of digital and mixed signal interconnect and packaging. Topics covered include: single chip (surface mount and through-hole) and multichip packaging technology, packaging technology selection, electrical performance of packaging (Signal Integrity), thermal design, electrical design of printed circuit boards, backplane interconnect, receiver and driver selection, EMI control, CAD tools, and measurement issues. Also included is the design of Power Delivery Systems and Power Integrity for PCBs and on-chip.